485总线隔离收发模块
目前，我司产品的UL档案异常，2025-08-06后的UL认证处于失效状态。我司正在积极沟通处理，不便之处敬请谅解。
TTL/CMOS电平和485差分信号相互转换的隔离收发模块。
——可实现信号隔离、信号转换、延长通信距离、增加通信节点、485总线防护等功能。
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485总线隔离收发模块 筛选型号个数：共 66 个，请查看下方表格。
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系列标题
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集成电源
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通道数
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传输速率(bps)
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输入电压(VDC)
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节点数
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隔离电压
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封装形式
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特性说明
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资料下载 (3D/PCB封装库/原理图库)
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认证/标准
技术
手册样品
申请
| TDA51S485HC | √ | 1 | 500k | 3.3 | 256 | 5000VDC | SOIC | 高隔离 | - | - | - | - |
| TDA51S485HC | √ | 1 | 500k | 3.3 | 256 | 5000VDC | SOIC | 高隔离 | - | |||
| TD041S485H | - | 1 | 20M | 3.3,5 | 256 | 3750VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD041S485H | - | 1 | 20M | 3.3,5 | 256 | 3750VAC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD(H)541S485H-A | √ | 1 | 500k | 5 | 256 | 3750VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD541S485H-A | √ | 1 | 500K | 5 | 256 | 3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | ||||
| TD(H)541S485S-F | √ | 1 | 20M | 5 | 256 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD541S485S-F | √ | 1 | 20M | 5 | 256 | 3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD(H)541S485S-F1 | √ | 1 | 20M | 5 | 256 | 3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD541S485S-F1 | √ | 1 | 20M | 5 | 256 | 3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD(H)541S485S-FT | √ | 1 | 20M | 5 | 256 | 3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD541S485S-FT | √ | 1 | 20M | 5 | 256 | 3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD041S485H-A | √ | 1 | 250k | 3.3,5 | 256 | 3750VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD041S485H-A | √ | 1 | 250K | 5 | 256 | 3750VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD041S485S-F1 | - | 1 | 20M | 3.3,5 | 256 | 3750VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD041S485S-F1 | - | 1 | 20M | 5 | 256 | 3750VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD301D485H-AB | √ | 1 | 11.52k | 3.3 | 128 | 2500VDC | DIP | 高隔离 | - | - | - | - |
| TD301D485H-AB | √ | 1 | 11.52K | 3.3 | 128 | 2500VDC | DIP | 高隔离 | - | |||
| TD341S485H | √ | 1 | 20M | 3.3 | 256 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD341S485H | √ | 1 | 20M | 3.3 | 256 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD341S485S-F | √ | 1 | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD341S485S-F | √ | 1 | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD341S485S-F1 | √ | 1 | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD341S485S-F1 | √ | 1 | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD341S485S-FT | √ | 1 | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD341S485S-FT | √ | 1 | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD5(3)21D485 | √ | 1 | 19.2K | 3.3,5 | 64 | 2500VDC | DIP | 开板式低速 | - | - | - | - |
| TD321D485 | √ | 1 | 19.2K | 3.3 | 64 | 2500VDC | DIP | 开板式低速 | ||||
| TD521D485 | √ | 1 | 19.2K | 5 | 64 | 2500VDC | DIP | 开板式低速 | ||||
| TD5(3)21D485-L | √ | 1 | 19.2K | 3.3,5 | 16 | 3000VDC | DIP | 超低功耗 | - | - | - | - |
| TD321D485-L | √ | 1 | 19.2K | 3.3 | 16 | 3000VDC | DIP | 超低功耗 | ||||
| TD5(3)21D485H | √ | 1 | 200K | 3.3,5 | 64 | 3000VDC | DIP | 开板式高速 | - | - | - | - |
| TD321D485H | √ | 1 | 200K | 3.3 | 64 | 3000VDC | DIP | 开板式高速 | ||||
| TD521D485H | √ | 1 | 200K | 5 | 64 | 5000VDC | DIP | 开板式高速 | ||||
| TD5(3)21D485H-A | √ | 1 | 500K | 3.3,5 | 128 | 3000VDC | DIP | 自动收发，开板式 | - | - | - | - |
| TD321D485H-A | √ | 1 | 500K | 3.3 | 128 | 3000VDC | DIP | 自动收发，开板式 | ||||
| TD521D485H-A | √ | 1 | 500K | 5 | 128 | 3000VDC | DIP | 自动收发，开板式 | ||||
| TD5(3)21D485H-E | √ | 1 | 500K | 3.3,5 | 256 | 3000VDC | DIP | 增强版，总线兼容性好 | - | - | - | - |
| TD321D485H-E | √ | 1 | 500K | 3.3 | 256 | 3000VDC | DIP | 增强版，总线兼容性好 | ||||
| TD521D485H-E | √ | 1 | 500K | 5 | 256 | 3000VDC | DIP | 增强版，总线兼容性好 | ||||
| TD5(3)21S485 | √ | 1 | 19.2K | 3.3,5 | 64 | 2500VDC | SMD | 开板贴片式，低速 | - | - | - | - |
| TD321S485 | √ | 1 | 19.2K | 3.3 | 64 | 2500VDC | SMD | 开板贴片式，低速 | ||||
| TD521S485 | √ | 1 | 19.2K | 5 | 64 | 2500VDC | SMD | 开板贴片式，低速 | ||||
| TD5(3)21S485H | √ | 1 | 200K | 3.3,5 | 64 | 3000VDC | SMD | 开板贴片式 | - | - | - | - |
| TD321S485H | √ | 1 | 200K | 3.3 | 64 | 3000VDC | SMD | 开板贴片式 | ||||
| TD521S485H | √ | 1 | 200K | 5 | 64 | 3000VDC | SMD | 开板贴片式 | ||||
| TD5(3)21S485H-A | √ | 1 | 500K | 3.3,5 | 128 | 3000VDC | SMD | 自动收发，开板贴片式 | - | - | - | - |
| TD321S485H-A | √ | 1 | 500K | 3.3 | 128 | 3000VDC | SMD | 自动收发，开板贴片式 | ||||
| TD521S485H-A | √ | 1 | 500K | 5 | 128 | 3000VDC | SMD | 自动收发，开板贴片式 | ||||
| TD5(3)21S485H-E | √ | 1 | 500K | 3.3,5 | 256 | 3000VDC | SMD | 增强版，总线兼容性好 | - | - | - | - |
| TD321S485H-E | √ | 1 | 500K | 3.3 | 256 | 3000VDC | SMD | 增强版，总线兼容性好 | ||||
| TD521S485H-E | √ | 1 | 500K | 5 | 256 | 3000VDC | SMD | 增强版，总线兼容性好 | ||||
| TD5(3)22D485H-A | √ | 2 | 120K | 3.3,5 | 32 | 2500VDC | DIP | 双路自动收发通道隔离 | - | - | - | - |
| TD322D485H-A | √ | 2 | 120K | 3.3 | 32 | 2500VDC | DIP | 双路自动收发通道隔离 | ||||
| TD522D485H-A | √ | 2 | 120K | 5 | 32 | 2500VDC | DIP | 双路自动收发通道隔离 | ||||
| TD5(3)31S485 | √ | 1 | 19.2K | 3.3,5 | 64 | 2500VDC | SMD | 小体积SMD，低速 | - | - | - | - |
| TD331S485 | √ | 1 | 19.2K | 3.3 | 64 | 2500VDC | SMD | 小体积SMD，低速 | ||||
| TD531S485 | √ | 1 | 19.2K | 5 | 64 | 2500VDC | SMD | 小体积SMD，低速 | ||||
| TD5(3)31S485-L | √ | 1 | 19.2K | 3.3,5 | 16 | 2500VDC | SMD | 超低功耗 | - | - | - | - |
| TD331S485-L | √ | 1 | 19.2K | 3.3 | 16 | 2500VDC | SMD | 超低功耗 | ||||
| TD531S485-L | √ | 1 | 19.2K | 5 | 16 | 2500VDC | SMD | 超低功耗 | ||||
| TD5(3)31S485H | √ | 1 | 150K | 3.3,5 | 128 | 2500VDC | SMD | 小体积SMD封装 | - | - | - | - |
| TD331S485H | √ | 1 | 150K | 3.3 | 128 | 2500VDC | SMD | 小体积SMD封装 | ||||
| TD531S485H | √ | 1 | 150K | 5 | 128 | 2500VDC | SMD | 小体积SMD封装 | ||||
| TD5(3)31S485H-A | √ | 1 | 150K | 3.3,5 | 128 | 2500VDC | SMD | 自动收发 | - | - | - | - |
| TD331S485H-A | √ | 1 | 150K | 3.3 | 128 | 2500VDC | SMD | 自动收发 | ||||
| TD531S485H-A | √ | 1 | 150K | 3.3 | 128 | 2500VDC | SMD | 自动收发 | ||||
| TD5(3)31S485H-E | √ | 1 | 500K | 3.3,5 | 256 | 2500VDC | SMD | SMD增强版，总线兼容性好 | - | - | - | - |
| TD331S485H-E | √ | 1 | 500K | 3.3 | 256 | 2500VDC | SMD | SMD增强版，总线兼容性好 | ||||
| TD531S485H-E | √ | 1 | 500K | 5 | 256 | 2500VDC | SMD | SMD增强版，总线兼容性好 | ||||
| TD541S485H | √ | 1 | 20M | 5 | 256 | 5000VDC&3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD541S485H | √ | 1 | 20M | 5 | 256 | 5000VDC&3000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD541S485H-S | √ | 1 | 10M | 5 | 256 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TDH5(3)01D485H | √ | 1 | 115.2K | 3.3,5 | 32 | 3750VAC | DIP | 高隔离 | - | - | - | - |
| TDH301D485H | √ | 1 | 115.2K | 3.3 | 32 | 3750VAC | DIP | 高隔离 | ||||
| TDH501D485H | √ | 1 | 115.2K | 5 | 32 | 3750VAC | DIP | 高隔离 | ||||
| TDHx01D485H-E | √ | 1 | 1M | 3.3,5 | 256 | 5000VDC | DIP | 单路高速高隔离 | - | - | - | - |
| TDH301D485H-E | √ | 1 | 1M | 3.3 | 256 | 5000VDC | DIP | 单路高速高隔离 | ||||
| TDH501D485H-E | √ | 1 | 1M | 5 | 256 | 5000VDC | DIP | 单路高速高隔离 | ||||
| TDHx01D485H2 | √ | 1 | 1M | 3.3,5 | 128 | 5000VDC | DIP | 单路高速高隔离 | - | - | - | - |
| TDH301D485H2 | √ | 1 | 1M | 3.3 | 128 | 5000VDC | DIP | 单路高速高隔离 | ||||
| TDH501D485H2 | √ | 1 | 1M | 5 | 128 | 5000VDC | DIP | 单路高速高隔离 | ||||
| TDx01D485H | √ | 1 | 200K | 3.3,5 | 32 | 2500VDC | DIP | 高速通用型 | - | - | - | - |
| TD301D485HG | √ | 1 | 200K | 3.3 | 32 | 2500VDC | DIP | 高速通用型 |
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| TD501D485HG | √ | 1 | 200K | 5 | 32 | 2500VDC | DIP | 高速通用型 |
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| TD301D485H | √ | 1 | 200K | 3.3 | 32 | 2500VDC | DIP | 高速通用型 | ||||
| TD501D485H | √ | 1 | 200K | 5 | 32 | 2500VDC | DIP | 高速通用型 | ||||
| TDx01M485(G) | √ | 1 | 500K | 3.3,5 | 64 | 2500VDC | DIP | 超小体积，自动收发 | - | - | - | - |
| TD301M485 | √ | 1 | 500K | 3.15-3.45 | 64 | 2500VDC | DIP | 超小体积，自动收发 | ||||
| TD301M485G | √ | 1 | 500K | 3.15-3.45 | 64 | 2500VDC | DIP | - |
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| TD501M485 | √ | 1 | 500K | 4.75-5.25 | 64 | 2500VDC | DIP | 超小体积，自动收发 | ||||
| TD501M485G | √ | 1 | 500K | 4.75-5.25 | 64 | 2500VDC | DIP | - |
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| TDx12P485 | √ | 2 | 9.6K | 3.3,5 | 32 | 2500VDC | DIP | 双通道低速 | - | - | - | - |
| TDx12P485H | √ | 2 | 200K | 3.3,5 | 32 | 2500VDC | DIP | 双通道 | - | - | - | - |
| TDx1IP485H | √ | 2 | 115.2K | 3.3,5 | 32 | 2500VDC | DIP | 双通道相互隔离 | - | - | - | - |
| TD5(3)B1D485H | √ | 1 | 200K | 3.3,5 | 64 | 3000VDC | DIP | 开板式高速 | - | - | - | - |
| TD3B1D485H | √ | 1 | 200k | 3.3 | 64 | 3000VDC | DIP | 高速通用型 | ||||
| TDx01D485 | √ | 1 | 9.6K | 3.3,5 | 32 | 2500VDC | DIP | 高隔离 | - | - | - | - |
| TD301D485 | √ | 1 | 9.6K | 3.3 | 32 | 2500VDC | DIP | 高隔离 | - | |||
| TD501D485 | √ | 1 | 9.6K | 5 | 32 | 3000VDC | DIP | 增强版，总线兼容性好 | - | |||
| TDx01D485H-A | √ | 1 | 115.2k | 3.3,5 | 32 | 2500VDC | DIP | 自动收发 | - | - | - | - |
| TD501D485H-A | √ | 1 | 115.2k | 5 | 32 | 2500VDC | DIP | 自动收发 | ||||
| TD301D485H-A | √ | 1 | 115.2k | 3.3 | 32 | 2500VDC | DIP | 自动收发 | ||||
| TDx01D485H-E | √ | 1 | 500k | 3.3,5 | 256 | 3000VDC | DIP | 增强版，总线兼容性好 | - | - | - | - |
| TD301D485H-E | √ | 1 | 500k | 3.3 | 256 | 3000VDC | DIP | 增强版，总线兼容性好 | ||||
| TD501D485H-E | √ | 1 | 500k | 5 | 256 | 3000VDC | DIP | 增强版，总线兼容性好 | ||||
| TDx11D485H | √ | 1 | 200k | 3.3,5 | 32 | 3000VDC | DIP | 高隔离 | - | - | - | - |
| TD311D485H | √ | 1 | 200k | 3.3 | 32 | 3000VDC | DIP | 高隔离 | - | |||
| TD511D485H | √ | 1 | 200k | 5 | 32 | 3000VDC | DIP | 高隔离 | - |
* 上方产品参数仅供参考，详细技术参数请以技术规格书为准
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系列标题
